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1

[IEEE 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - Boston, MA, USA (2019.6.2-2019.6.4)] 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - A 1.04 - 4V, Digital-Intensive Dual-Mode BLE 5.0/IEEE 802.15.4 Transceiver SoC with extended range in 28nm CMOS

Kim, Nam-Seog, Kim, Myoung-Gyun, Verma, Ashutosh, Seol, Gyungseon, Kim, Shinwoong, Lee, Seokwon, Lo, Chilun, Han, Jaeyeol, Jo, Ikkyun, Kim, Chulho, Yao, Chih-Wei, Lee, Jongwoo

Année:

2019

Langue:

english

Fichier:

PDF, 347 KB

english, 2019

2

[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages

Son, Ho-Young, Lee, Woong-Sun, Noh, Seung-Kwon, Suh, Min-Suk, Oh, Jae-Sung, Kim, Nam-Seog

Année:

2013

Langue:

english

Fichier:

PDF, 888 KB

english, 2013

3

[IEEE 2005 IEEE International Symposium on Circuits and Systems - Kobe, Japan (23-26 May 2005)] 2005 IEEE International Symposium on Circuits and Systems - A pseudo-differential CMOS receiver insensitive to input common mode level

Nam-Seog Kim,, Uk-Rae Cho,, Hyun-Geun Byun,

Année:

2005

Langue:

english

Fichier:

PDF, 1.68 MB

english, 2005

4

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Mechanical and Thermal Characterization of TSV Multi-chip Stacked Packages for Reliable 3D IC Applications

Son, Ho-Young, Oh, Tackeun, Hong, Joo-Wan, Lee, Byeong-Do, Shin, Ji-Hyuk, Kim, Sung-Ho, Kim, Nam-Seog

Année:

2016

Langue:

english

Fichier:

PDF, 357 KB

english, 2016

5

[IEEE 2017 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2017.2.5-2017.2.9)] 2017 IEEE International Solid-State Circuits Conference (ISSCC) - 24.8 A 14nm fractional-N digital PLL with 0.14psrms jitter and −78dBc fractional spur for cellular RFICs

Yao, Chih-Wei, Loke, Wing Fai, Ni, Ronghua, Han, Yongping, Li, Haoyang, Godbole, Kunal, Zuo, Yongrong, Ko, Sangsoo, Kim, Nam-Seog, Han, Sangwook, Jo, Ikkyun, Lee, Joonhee, Han, Juyoung, Kwon, Daehyeon

Année:

2017

Langue:

english

Fichier:

PDF, 2.51 MB

english, 2017

6

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Effects of NCF and UBM Materials on Electromigration Reliabilities of Sn-Ag Microbumps for Advanced 3D Packaging

Son, Kirak, Kim, Gahui, Ryu, Hyodong, Park, Gyu-Tae, Son, Ho-Young, Kim, Nam-Seog, Yang, Cheol-Woong, Kim, Young-Cheon, Han, Jeong Sam, Park, Young-Bae

Année:

2019

Langue:

english

Fichier:

PDF, 619 KB

english, 2019

7

A 1.2-V 1.5-Gb/s 72-Mb DDR3 SRAM

Uk-Rae Cho, Tae-Hyoung Kim, Yong-Jin Yoon, Jong-Cheol Lee, Dae-Gi Bae, Nam-Seog Kim, Kang-Young Kim, Young-Jae Son, Jeong-Suk Yang, Kwon-Il Sohn, Sung-Tae Kim, In-Yeol Lee, Kwang-Jin Lee, Tae-Gyoung K

Journal:

IEEE Journal of Solid-State Circuits

Année:

2003

Langue:

english

Fichier:

PDF, 851 KB

english, 2003

8

[IEEE ISCAS 2003. International Symposium on Circuits and Systems - Bangkok, Thailand (25-28 May 2003)] Proceedings of the 2003 International Symposium on Circuits and Systems, 2003. ISCAS '03. - New dynamic logic-level converters for high performance application

Nam-Seog Kim,, Yong-Jin Yoon,, Uk-Rae Cho,, Hyun-Geun Byun,

Année:

2003

Langue:

english

Fichier:

PDF, 254 KB

english, 2003

9

[IEEE IEEE 2005 Custom Integrated Circuits Conference, 2005. - San Jose, CA, USA (Sept. 18-21, 2005)] Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. - Low voltage wide range DLL-based quad-phase core clock generator for high speed network SRAM application

Nam-Seog Kim,, Uk-Rae Cho,, Hyun-Geun Byun,

Année:

2005

Langue:

english

Fichier:

PDF, 400 KB

english, 2005

10

[IEEE CICC Custom Integrated Circuits Conference - San Jose, CA, USA (21-24 Sept. 2003)] Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003. - Programmable and automatically adjustable on-die terminator for DDR3-SRAM interface

Nam-Seog Kim,, Yong-Jin Yoon,, Uk-Rae Cho,, Hyun-Geun Byun,

Année:

2003

Langue:

english

Fichier:

PDF, 262 KB

english, 2003

11

[IEEE 2013 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Singapore, Singapore (2013.11.11-2013.11.13)] 2013 IEEE Asian Solid-State Circuits Conference (A-SSCC) - A 0.2 to 1.7 GHz low-jitter integer-N QPLL for power efficient direct digital RF modulator

Kim, Nam-Seog, Rabaey, Jan M.

Année:

2013

Langue:

english

Fichier:

PDF, 858 KB

english, 2013

12

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction

Jiang, Tengfei, Wu, Chenglin, Su, Peng, Liu, Xi, Chia, Pierre, Li, Li, Son, Ho-Young, Oh, Jae-Sung, Byun, Kwang-Yoo, Kim, Nam-Seog, Im, Jay, Huang, Rui, Ho, Paul S.

Année:

2013

Langue:

english

Fichier:

PDF, 1.17 MB

english, 2013

13

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test

Jongguk Choe,, Jae-Won Jang,, Nam-Seog Kim,, Soon-Bok Lee,

Année:

2012

Langue:

english

Fichier:

PDF, 420 KB

english, 2012

14

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of high temperature storage on the stress and reliability of 3D stacked chip

Jiang, Tengfei, Wu, Chenglin, Su, Peng, Chia, Pierre, Li, Li, Son, Ho-Young, Suh, Min-Suk, Kim, Nam-Seog, Im, Jay, Huang, Rui, Ho, Paul S.

Année:

2014

Langue:

english

Fichier:

PDF, 2.90 MB

english, 2014

15

[IEEE 2008 IEEE Workshop on Signal Processing Systems (SiPS) - Washington, DC, USA (2008.10.8-2008.10.10)] 2008 IEEE Workshop on Signal Processing Systems - Multi-mode sub-Nyquist rate digital-to-analog conversion for direct waveform synthesis

Yuan-Shih Chen, Stanley, Nam-Seog Kim,, Rabaey, Jan M.

Année:

2008

Langue:

english

Fichier:

PDF, 311 KB

english, 2008

16

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Structure effects on the electrical reliability of fine-pitch Cu micro-bumps for 3D integration

Lee, Byeong-Rok, Kim, June-Bum, Kim, Seung-hyun, Bae, Byeong-Hyun, Son, Ho-Young, Oh, Tac-Keun, Suh, Min-Suk, Kim, Nam-Seog, Park, Young-Bae

Année:

2014

Langue:

english

Fichier:

PDF, 2.15 MB

english, 2014

17

[IEEE 2013 IEEE International Interconnect Technology Conference - IITC - Kyoto, Japan (2013.06.13-2013.06.15)] 2013 IEEE International Interconnect Technology Conference - IITC - Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures

Jiang, Tengfei, Ryu, Suk-Kyu, Im, Jay, Son, Ho-Young, Kim, Nam-Seog, Huang, Rui, Ho, Paul S.

Année:

2013

Langue:

english

Fichier:

PDF, 765 KB

english, 2013

18

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration

Park, Young-Bae, Kim, Seung-Hyun, Park, Jong-Jin, Kim, June-Bum, Son, Ho-Young, Han, Kwon-Whan, Oh, Jae-Sung, Kim, Nam-Seog, Yoo, Sehoon

Année:

2013

Langue:

english

Fichier:

PDF, 918 KB

english, 2013

19

[IEEE 2015 Symposium on VLSI Circuits - Kyoto, Japan (2015.6.17-2015.6.19)] 2015 Symposium on VLSI Circuits (VLSI Circuits) - A 1Gb/s energy efficient triple-channel UWB-based cognitive radio

Kim, Nam-Seog, Rabaey, Jan M.

Année:

2015

Langue:

english

Fichier:

PDF, 842 KB

english, 2015

20

[IEEE 2015 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - Phoenix, AZ, USA (2015.5.17-2015.5.19)] 2015 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) - A 3–10mW, 3.1–10.6GHz integer-N QPLL with reference spur reduction technique for UWB-based cognitive radios

Kim, Nam-Seog, Rabaey, Jan M.

Année:

2015

Langue:

english

Fichier:

PDF, 501 KB

english, 2015

21

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Reliability of the SnBi lead finished Pb-free produet

Ki-Hwan Park,, Nam-Seog Kim,, Se-Yong Oh,

Année:

2002

Langue:

english

Fichier:

PDF, 457 KB

english, 2002

22

A High Data-Rate Energy-Efficient Triple-Channel UWB-Based Cognitive Radio

Kim, Nam-Seog, Rabaey, Jan M.

Journal:

IEEE Journal of Solid-State Circuits

Année:

2016

Langue:

english

Fichier:

PDF, 2.57 MB

english, 2016

23

A 14-nm 0.14-ps rms Fractional-N Digital PLL With a 0.2-ps Resolution ADC-Assisted Coarse/Fine-Conversion Chopping TDC and TDC Nonlinearity Calibration

Yao, Chih-Wei, Ni, Ronghua, Lau, Chung, Wu, Wanghua, Godbole, Kunal, Zuo, Yongrong, Ko, Sangsoo, Kim, Nam-Seog, Han, Sangwook, Jo, Ikkyun, Lee, Joonhee, Han, Juyoung, Kwon, Daehyeon, Kim, Chulho, Kim,

Journal:

IEEE Journal of Solid-State Circuits

Année:

2017

Langue:

english

Fichier:

PDF, 7.36 MB

english, 2017

24

A Dual-Resolution Wavelet-Based Energy Detection Spectrum Sensing for UWB-Based Cognitive Radios

Kim, Nam-Seog, Rabaey, Jan M.

Journal:

IEEE Transactions on Circuits and Systems I: Regular Papers

Année:

2017

Langue:

english

Fichier:

PDF, 7.54 MB

english, 2017

25

A 3.1-10.6-GHz 57-Bands CMOS Frequency Synthesizer for UWB-Based Cognitive Radios

Kim, Nam-Seog, Rabaey, Jan M.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2018

Langue:

english

Fichier:

PDF, 6.07 MB

english, 2018

26

A Digital-Intensive Extended-Range Dual-Mode BLE5.0 and IEEE802.15.4 Transceiver SoC

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2020

Fichier:

PDF, 3.51 MB

2020